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型号 厂家 描述 大小 页数 厂家标志
52455 KB
52465-1491 KB
52479-0200 KB
52584-1079 Molex Electronics Ltd. 1.00mm (.039") Pitch Receptacle, Dual Row Surface Mount, Vertical Stacking, 8.00,9.00, 10.00, and 18.00mm (.315, .354, .394 and .709") Stacking Heights, 100 Circuits,Lead-free 407 KB 6
52559-2070 Molex Electronics Ltd. 1.00mm (.039") Pitch Receptacle, Dual Row Surface Mount, Vertical Stacking, 8.00,9.00, 10.00, and 18.00mm (.315, .354, .394 and .709") Stacking Heights, 100 Circuits,Lead-free 407 KB 6
52559-2090 Molex Electronics Ltd. STECKVERBINDER 0.5MM SMT VERT 20POL 95 KB 0
52432-1 Molex Electronics Ltd. STECKVERBINDER 0.5MM SMT VERT 20POL 95 KB 0
522I Molex Electronics Ltd. STECKVERBINDER 0.5MM SMT VERT 20POL 95 KB 0
522710879 Molex Electronics Ltd. STECKVERBINDER 0.5MM SMT VERT 20POL 95 KB 0
52271-2869 Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 28 Circuits, Lead-free, High Barrier Packaging 478 KB 8
5227699-1 Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 28 Circuits, Lead-free, High Barrier Packaging 478 KB 8
52271-1269 Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging 478 KB 8
5226990-6 Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging 478 KB 8
5221244-1 Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging 478 KB 8
52245R Molex Electronics Ltd. 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging 478 KB 8
52266-0211 Molex Electronics Ltd. 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Systems 216 KB 2
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