| 型号 | 厂家 | 描述 | 大小 | 页数 | 厂家标志 |
|---|---|---|---|---|---|
| 70543-0052 | Molex Electronics Ltd. | 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .120" Pocket, Shrouded, 18Circuits, Tin (Sn) Plating | 429 KB | 4 | |
| 70280-0458 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 70247-3401 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7010 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 70065SBDD | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7011X1/7 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7015FB(885S02AA) | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7002D | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 70030 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 70028-2650 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7011X1/5 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 7004D-1M-3R3M | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | 294 KB | 4 | |
| 70107-0005 | Molex Electronics Ltd. | 2.54mm (.100") Pitch SL? Wire-to-Wire Crimp Housing, Single Row, Version A, without Mounting Ears, 6 Circuits | 119 KB | 2 | |
| 705430003 | Molex Electronics Ltd. | 2.54mm (.100") Pitch SL? Wire-to-Wire Crimp Housing, Single Row, Version A, without Mounting Ears, 6 Circuits | 119 KB | 2 | |
| 70545-0075 | Molex Electronics Ltd. | 2.54mm (.100") Pitch SL? Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC | 263 KB | 5 | |
| 70573-0009 | Molex Electronics Ltd. | 2.54mm (.100") Pitch SL? Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC | 263 KB | 5 |