| 型号 | 厂家 | 描述 | 大小 | 页数 | 厂家标志 |
|---|---|---|---|---|---|
| 70232-121 | KB | ||||
| 70233-111LF | KB | ||||
| 70236-901 | KB | ||||
| 70246-2601 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 |  |
| 7024S55PF | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70227-901 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 7027B | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 702088-01 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70228101 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70228-101 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70267-004 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 7026S25J | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70273-003F | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 7025L25PF | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 70274-003E26 | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
| 702BQFPCSM | Molex Electronics Ltd. | 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 187 KB | 4 | |
