| 型号 | 厂家 | 描述 | 大小 | 页数 | 厂家标志 |
|---|---|---|---|---|---|
| ISD17150EY | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 |  |
| ISD1612P | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 | |
| ISD1612S | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 | |
| ISD1420SYR | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 | |
| ISD1610S | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 | |
| ISC251G2D-24C | Winbond | Multi-Message Single-Chip Voice Record & Playback Devices | 356 KB | 24 | |
| IS93C46A | INTEGRATED SILICON SOLUTION, INC | 1,024-BIT SERIAL ELECTRICALLY ERASABLE PROM | 74 KB | 13 |  |
| IS93C46G | INTEGRATED SILICON SOLUTION, INC | 1,024-BIT SERIAL ELECTRICALLY ERASABLE PROM | 74 KB | 13 | |
| IS82C55A-5Z | INTERSIL CORPORATION | CMOS Programmable Peripheral Interface | 554 KB | 29 |  |
| IS82C5496S2485 | INTERSIL CORPORATION | CMOS Programmable Peripheral Interface | 554 KB | 29 | |
| IS75V16F64GS16-7080DI | INTEGRATED SILICON SOLUTION, INC | 64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP) | 239 KB | 50 | |
| IS80LV32-12PL | INTEGRATED SILICON SOLUTION, INC | 64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP) | 239 KB | 50 | |
| IS66WV51216BLL-55TLI | INTEGRATED SILICON SOLUTION, INC | 64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP) | 239 KB | 50 | |
| IS63LV1024-10JLI | INTEGRATED SILICON SOLUTION, INC | 64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP) | 239 KB | 50 | |
| IS62WV5128ALL-70HI | INTEGRATED SILICON SOLUTION, INC | 512K x 8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM | 85 KB | 14 | |
| IS62WV2568BLL-55H | INTEGRATED SILICON SOLUTION, INC | 512K x 8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM | 85 KB | 14 | |
