| 型号 | 厂家 | 描述 | 大小 | 页数 | 厂家标志 |
|---|---|---|---|---|---|
| RD28F64008J3120 | KB | ||||
| RD27FM(D)-T1 27 | KB | ||||
| RD24S-T1(24V) | KB | ||||
| RD22P(22V) | KB | ||||
| RD28F3204W30T70 | INTEL CORPORATION | 1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) | 749 KB | 84 |  |
| rd2.0m-t2b | INTEL CORPORATION | 1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) | 749 KB | 84 | |
| RD2.7S 2.7V | INTEL CORPORATION | 1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) | 749 KB | 84 | |
| RD2.4S\2.4V | INTEL CORPORATION | 1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) | 749 KB | 84 | |
| RD27E | EIC discrete Semiconductors | SILICON ZENER DIODES | 75 KB | 4 |  |
| RD22S 22V | EIC discrete Semiconductors | SILICON ZENER DIODES | 75 KB | 4 | |
| RD27S-T1(27V) | EIC discrete Semiconductors | SILICON ZENER DIODES | 75 KB | 4 | |
| RD27S-T2 | EIC discrete Semiconductors | SILICON ZENER DIODES | 75 KB | 4 | |
| RD28F3204C3T70 | INTEL CORPORATION | 3 VOLT INTEL Advanced+ Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye | 1223 KB | 70 | |
| RD2.7M-T2B(2V7) | INTEL CORPORATION | 3 VOLT INTEL Advanced+ Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye | 1223 KB | 70 | |
| RD20L | INTEL CORPORATION | 3 VOLT INTEL Advanced+ Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye | 1223 KB | 70 | |
| RD2.7F | EIC discrete Semiconductors | ZENER DIODES | 47 KB | 3 | |
